Technomelt Supra is the most advanced hot melt available on the market today. Using Metallocene as a base polymer, they combine superior bond strength with high temperature resistance making Technomelt Supra ideal for difficult substrates and deep freeze applications. Technomelt Supra has many benefits over conventional EVA based hot melts that will improve your adhesive application process in addition to reducing consumption, with low temperature options for lower energy costs and increased operator safety. An extremely clean cut off means a potential end to stringing and cobwebbing.
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The highest quality packaging adhesive offering high performance at temperatures as low as 100°c. The extra stability of Supra provides a superior bond and combined with the clean jetting leads to less production downtime. Supra is the perfect option for all application methods including pattern control / stitching. Below is a video demonstrating the benefits of Technomelt Supra 100 Cool in packaging applications.
A revolution in the graphic arts industry offering advanced adhesion for spine gluing, providing a more reliable bond with lower consumption and efficiency improvements. Technomelt Ultra is particularly effective for digital printers, and provides a bridge between EVA and PUR technologies.
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