Technomelt Supra 100 Cool with the lowest application temperature in the market
New Henkel hot melt adhesive sets high standards.
With an application temperature of 100°C, Technomelt Supra 100 Cool from Henkel is the new record-holder among hot melt adhesives used in the packaging industry. Combined with the benefits of the proven Supra product range, this Henkel innovation delivers higher efficiency in packaging production while also promoting sustainability in customer operations.
The on-going drive toward high bond quality, high yield and long-term availability is getting more important in packaging production. In addition to its low application temperature of 100 degrees Celsius and its high adhesive strength, Technomelt Supra 100 Cool is also characterized by its wide-ranging suitability in case sealing, carton closing and tray erection.
Production trials carried out by consumer goods manufacturers throughout Europe have demonstrated that the low application temperature of Technomelt Supra 100 Cool reduces the energy requirement compared to conventional hot melts by up to 50%. Technomelt Supra 100 Cool is like all products of the Technomelt Supra line suitable for application in the food industry.
A further plus offered by innovative Technomelt Supra 100 Cool is its good heat resistance and cold flexibility, which enables its use for both warm-filling and deep-freeze applications. Compared to conventional hot melts, this new range reduces adhesive consumption – in the case of carton sealing, for example – by up to 40%.
The low application temperature also means faster applicator start-up. It also enhances one of the decisive advantages of Henkel’s Supra technology: thanks to this innovative hot melt, the amount of wear and tear to which machine components and applicators are subjected can be appreciably reduced, with the maintenance input involved in removing residues / stringing also diminishing. Equipment and spare part lifetime is greatly increased and production efficiency maximised.
Technomelt Supra 100 Cool is the hot melt with the lowest application temperature of its class in the marketplace. With this new generation of low-temperature packaging adhesives, Henkel combines innovation with sustainability, further underlining its commitment to progress in support of the packaging sector and the consumer goods industry.